Flip chip PBGAs: Board-level reliability and testing

Flip chip packaging has seen explosive growth in recent years, with more and more high-performance devices being designed in flip chip technology. Additionally, flip-chip-in-package (FCIP) is increasingly seen as a solution for higher I/O devices. LSI Logic has developed an assembly process for orga...

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Veröffentlicht in:	Advanced packaging 2003-06, Vol.12 (6), p.35-36
Hauptverfasser:	Chung, C, Kutlu, Z, Rajagopalan, S
Format:	Magazinearticle
Sprache:	eng
Online-Zugang:	Volltext
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