A universal interface for plug-and-play assembly of stretchable devices

Stretchable hybrid devices have enabled high-fidelity implantable 1 – 3 and on-skin 4 – 6 monitoring of physiological signals. These devices typically contain soft modules that match the mechanical requirements in humans 7 , 8 and soft robots 9 , 10 , rigid modules containing Si-based microelectroni...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Nature (London) 2023-02, Vol.614 (7948), p.456-462
Hauptverfasser: Jiang, Ying, Ji, Shaobo, Sun, Jing, Huang, Jianping, Li, Yuanheng, Zou, Guijin, Salim, Teddy, Wang, Changxian, Li, Wenlong, Jin, Haoran, Xu, Jie, Wang, Sihong, Lei, Ting, Yan, Xuzhou, Peh, Wendy Yen Xian, Yen, Shih-Cheng, Liu, Zhihua, Yu, Mei, Zhao, Hang, Lu, Zechao, Li, Guanglin, Gao, Huajian, Liu, Zhiyuan, Bao, Zhenan, Chen, Xiaodong
Format: Artikel
Sprache:eng
Schlagworte:
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Stretchable hybrid devices have enabled high-fidelity implantable 1 – 3 and on-skin 4 – 6 monitoring of physiological signals. These devices typically contain soft modules that match the mechanical requirements in humans 7 , 8 and soft robots 9 , 10 , rigid modules containing Si-based microelectronics 11 , 12 and protective encapsulation modules 13 , 14 . To make such a system mechanically compliant, the interconnects between the modules need to tolerate stress concentration that may limit their stretching and ultimately cause debonding failure 15 – 17 . Here, we report a universal interface that can reliably connect soft, rigid and encapsulation modules together to form robust and highly stretchable devices in a plug-and-play manner. The interface, consisting of interpenetrating polymer and metal nanostructures, connects modules by simply pressing without using pastes. Its formation is depicted by a biphasic network growth model. Soft–soft modules joined by this interface achieved 600% and 180% mechanical and electrical stretchability, respectively. Soft and rigid modules can also be electrically connected using the above interface. Encapsulation on soft modules with this interface is strongly adhesive with an interfacial toughness of 0.24 N mm −1 . As a proof of concept, we use this interface to assemble stretchable devices for in vivo neuromodulation and on-skin electromyography, with high signal quality and mechanical resistance. We expect such a plug-and-play interface to simplify and accelerate the development of on-skin and implantable stretchable devices. A universal interface connects soft, rigid and encapsulation modules together to form robust, stretchable devices in a plug-and-play manner by pressing without using pastes, which will simplify and accelerate development of on-skin and implantable devices.
ISSN:0028-0836
1476-4687
DOI:10.1038/s41586-022-05579-z