Thermally stimulated creep (TSCr) study of viscoelastic behavior and physical aging of a polymeric matrix composite for spacecraft structures

Thermally Stimulated Creep (TSCr) mechanical spectroscopy has been used to analyze molecular movements in KMU‐4lcarbon/epoxy composite material around the glass transition temperature. This technique is powerful to characterize the microstructure and micromechanical properties of the epoxy matrix and their evolution upon thermal aging. Three cooperative submodes have been distinguished by resolving the fine structure of the material complex α‐retardation mode. The elementary processes constituting this mode possess activation enthalpies and preexponential factors that strongly depend on the thermal history of the sample. The activation parameters of the composite are subject to perceptible evolution due to postcuring degradation. The α‐mode associated complex spectrum shifts towards higher temperatures by 27°C as a consequence of a series of quenching in the temperature range 260 to 0°C; the material shows a rise in the fragility and a deterioration in the crack‐growth resistance qualities. © 2002 Wiley Periodicals, Inc. J Appl Polym Sci 85: 342–350, 2002