Cardanol-based adhesive with reduced formaldehyde emission to produce particleboards with waste from bean crops

Free formaldehyde is a carcinogen whose emission reduction in particleboard has been studied recently to mitigate this environmental and human health problem. One alternative to reduce the emission of formaldehyde in particleboards is by using adhesives produced from natural sources. Cardanol-formal...

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Veröffentlicht in:Environmental science and pollution research international 2023-04, Vol.30 (16), p.48270-48287
Hauptverfasser: Faria, Douglas Lamounier, Scatolino, Mário Vanoli, de Oliveira, Juliano Elvis, Gonçalves, Fabricio Gomes, Soriano, Julio, de Paula Protásio, Thiago, Lelis, Roberto Carlos Costa, de Carvalho, Luisa Maria Hora, Mendes, Lourival Marin, Junior, José Benedito Guimarães
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Sprache:eng
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Zusammenfassung:Free formaldehyde is a carcinogen whose emission reduction in particleboard has been studied recently to mitigate this environmental and human health problem. One alternative to reduce the emission of formaldehyde in particleboards is by using adhesives produced from natural sources. Cardanol-formaldehyde is an environmentally friendly adhesive made with cashew nut liquid, a byproduct from the cashew chain. This work aimed to produce particleboard using cardanol-formaldehyde in place of urea. In addition, different proportions of bean straw wastes were used to replace pine wood. The combination of eco-friendly adhesive and lignocellulosic waste particles could result in a product that meets market demands while being environmentally nonaggressive. Cardanol-formaldehyde promoted a higher modulus of elasticity (MOE) (1172 MPa) and modulus of rupture (MOR) (4.39 MPa) about panels glued with urea–formaldehyde, which presented a MOE of 764 MPa and MOR of 2.45 MPa. Furthermore, the cardanol-formaldehyde adhesive promoted a 93% reduction in formaldehyde emission, with a reduction from 16.76 to 1.09 mg/100 g oven-dry board for particleboards produced with cardanol-formaldehyde, indicating potential as an adhesive in the particleboard industry.
ISSN:1614-7499
0944-1344
1614-7499
DOI:10.1007/s11356-023-25764-5