Measurement of temperature in active high-power AlGaN/GaN HFETs using Raman spectroscopy

We report on the noninvasive measurement of temperature, i.e., self-heating effects, in active AlGaN/GaN HFETs grown on sapphire and SiC substrates. Micro-Raman spectroscopy was used to produce temperature maps with /spl ap/1 μm spatial resolution and a temperature accuracy of better than 10/spl deg...

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Veröffentlicht in:IEEE electron device letters 2002-01, Vol.23 (1), p.7-9
Hauptverfasser: Kuball, M., Hayes, J.M., Uren, M.J., Martin, I., Birbeck, J.C.H., Balmer, R.S., Hughes, B.T.
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Sprache:eng
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Zusammenfassung:We report on the noninvasive measurement of temperature, i.e., self-heating effects, in active AlGaN/GaN HFETs grown on sapphire and SiC substrates. Micro-Raman spectroscopy was used to produce temperature maps with /spl ap/1 μm spatial resolution and a temperature accuracy of better than 10/spl deg/C. Significant temperature rises up to 180/spl deg/C were measured in the device gate-drain opening. Results from a three-dimensional (3-D) heat dissipation model are in reasonably good agreement with the experimental data. Comparison of devices fabricated on sapphire and SiC substrates indicated that the SiC substrate devices had /spl sim/5 times lower thermal resistance.
ISSN:0741-3106
1558-0563
DOI:10.1109/55.974795