Measurement of the residual stress in a Pt–aluminide bond coat
The residual stress induced in a Pt–aluminide bond coat formed on a single-crystal superalloy due to cooling from the manufacturing temperature, has been measured with the “wafer” curvature method. This approach revealed that the bond coat is in residual tension (about 140 MPa), consistent with the...
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Veröffentlicht in: | Scripta materialia 2002, Vol.46 (1), p.67-70 |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The residual stress induced in a Pt–aluminide bond coat formed on a single-crystal superalloy due to cooling from the manufacturing temperature, has been measured with the “wafer” curvature method. This approach revealed that the bond coat is in residual tension (about 140 MPa), consistent with the thermal expansion misfit. |
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ISSN: | 1359-6462 1872-8456 |
DOI: | 10.1016/S1359-6462(01)01198-8 |