High Resolution Photoemission Study of the 6H-SiC/SiO2 Interface

Core and valence band photoemission measurements with a spatial resolution of 150 microns were used to probe the SiO2/6H-SiC(0001) interface. To this end a thermally grown 100 nm thick oxide was etched back in the form of a wedge with a slope of 65 A/mm down to the SiC substrate. From an analysis of...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Veröffentlicht in:Materials science forum 1998-01, Vol.264-268, p.375-378
Hauptverfasser: Mattern, B., Bassler, M., Ley, Lothar, Pensl, Gerhard
Format: Artikel
Sprache:eng
Online-Zugang:Volltext
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:Core and valence band photoemission measurements with a spatial resolution of 150 microns were used to probe the SiO2/6H-SiC(0001) interface. To this end a thermally grown 100 nm thick oxide was etched back in the form of a wedge with a slope of 65 A/mm down to the SiC substrate. From an analysis of the energies and intensities of Si2p and Cls core levels as a function of position on the sample a 22 A thick interface layer has been identified which consists of silicon suboxide (SiO(1.5)) interspersed in a carbon matrix. The ratio of C:Si is 3:1 in this interface layer. The valence band offset between 6H-SiC and SiO2 was determined to be 2.9(1) eV. (Author)
ISSN:0255-5476
1662-9752
1662-9752
DOI:10.4028/www.scientific.net/MSF.264-268.375