High Resolution Photoemission Study of the 6H-SiC/SiO2 Interface
Core and valence band photoemission measurements with a spatial resolution of 150 microns were used to probe the SiO2/6H-SiC(0001) interface. To this end a thermally grown 100 nm thick oxide was etched back in the form of a wedge with a slope of 65 A/mm down to the SiC substrate. From an analysis of...
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Veröffentlicht in: | Materials science forum 1998-01, Vol.264-268, p.375-378 |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Core and valence band photoemission measurements with a spatial resolution of 150 microns were used to probe the SiO2/6H-SiC(0001) interface. To this end a thermally grown 100 nm thick oxide was etched back in the form of a wedge with a slope of 65 A/mm down to the SiC substrate. From an analysis of the energies and intensities of Si2p and Cls core levels as a function of position on the sample a 22 A thick interface layer has been identified which consists of silicon suboxide (SiO(1.5)) interspersed in a carbon matrix. The ratio of C:Si is 3:1 in this interface layer. The valence band offset between 6H-SiC and SiO2 was determined to be 2.9(1) eV. (Author) |
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ISSN: | 0255-5476 1662-9752 1662-9752 |
DOI: | 10.4028/www.scientific.net/MSF.264-268.375 |