Modelling and simulation for dielectric constant of aerogel
Aerogel exhibits several attractive features as an interconnect dielectric in ULSI, because of its ultralow dielectric constant ( ϵ eff=1∼4.2), high dielectric strength, and good gapfill capabilities. In this paper, a uniformly distributed pore structure model which shows a significant improvement c...
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Veröffentlicht in: | Microelectronic engineering 2000-12, Vol.54 (3), p.295-301 |
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Hauptverfasser: | , , , , , |
Format: | Artikel |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext |
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Zusammenfassung: | Aerogel exhibits several attractive features as an interconnect dielectric in ULSI, because of its ultralow dielectric constant (
ϵ
eff=1∼4.2), high dielectric strength, and good gapfill capabilities. In this paper, a uniformly distributed pore structure model which shows a significant improvement compared with parallel and serial models is presented to simulate the
ϵ
eff of aerogel. An empirical relation between the
ϵ
eff of aerogel and its porosity is obtained. At the same time, the effect of porosity, pore shape, pore size, pore-size distribution and pore distribution on the
ϵ
eff of aerogel is determined. It is found that the porosity is a major factor which affects
ϵ
eff. |
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ISSN: | 0167-9317 1873-5568 |
DOI: | 10.1016/S0167-9317(00)00257-4 |