An application of confocal scanning beam laser microscopy (CSBLM) to the electrodeposition of copper

Structural characteristics of copper electrodeposition in a laboratory-scale copper electrorefining cell, studied by confocal scanning beam laser microscopy (CSBLM), are presented. Quantitative description of the roughness of the surface is provided by three-dimensional reconstructed images, and sectional depth profiles of the surface via digital image processing are shown along with surface roughness distribution. Quantitative information about the effect of current density on surface roughness is of direct interest to industrial copper electrorefining.