Cure behavior and properties of an epoxy resin modified with a bismaleimide resin

A bismaleimide (BMI) resin was added to an epoxy system composed of N,N′‐tetraglycidyldiaminodiphenyl methane (TGDDM) and diaminodiphenyl methane (DDM). Cure behavior of the BMI modified epoxy resins was studied by a dynamic differential scanning calorimetry (DSC) method. Dynamic DSC thermograms of the BMI modified epoxy resins indicated unimodal reaction exothermic peaks. The overall heat of reaction per unit mass decreased with BMI composition. The residual heat of reactions of the epoxy blends cured at 180°C for 3 h increased with BMI composition. Thermal stability of the epoxy system improved by incorporating BMI resin. Flexural strength and modulus increased with BMI composition.