Torsional braid analysis of the aromatic amine cure of epoxy resins

The cure behavior of diglycidyl ether of bisphenol A (DGEBA) type of epoxy resins with three aromatic diamines, 4,4′‐diaminodiphenyl methane (DDM), 4,4′‐diaminodiphenyl sulfone (44DDS), and 3,3′‐diaminodiphenyl sulfone (33DDS) was studied by torsional braid analysis. For each curing agent the stoich...

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Veröffentlicht in:Journal of applied polymer science 1994-07, Vol.53 (4), p.429-440
1. Verfasser: Zukas, Walter X.
Format: Artikel
Sprache:eng
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Zusammenfassung:The cure behavior of diglycidyl ether of bisphenol A (DGEBA) type of epoxy resins with three aromatic diamines, 4,4′‐diaminodiphenyl methane (DDM), 4,4′‐diaminodiphenyl sulfone (44DDS), and 3,3′‐diaminodiphenyl sulfone (33DDS) was studied by torsional braid analysis. For each curing agent the stoichiometry of the resin mixtures was varied from a two to one excess of amino hydrogens per epoxy group to a two to one excess of epoxy groups per amino hydrogen. Isothermal cures of the resin mixtures were carried out from 70 to 210°C (range depending on epoxy—amine mixture), followed by a temperature scan to determine the glass transition temperature (Tg). The times to the isothermal liquid‐to‐rubber transition were shortest for the DDM mixtures and longest for the 44DDS mixtures. The liquid‐to‐rubber transition times were also shortest for the amine excess mixtures when stoichiometry was varied. A relatively rapid reaction to the liquid‐to‐rubber transition was observed for the epoxy excess mixtures, followed by an exceedingly slow reaction process at cure temperatures well above the Tg. This slow process was only observed for epoxy excess mixtures and eventually led to significant increases in Tg. Using time—temperature shifts of the glass transition temperature vs. logarithm of time, activation energies approximately 50% higher were derived for this process compared to those derived from the liquid‐to‐rubber transition. The rate of this reaction was virtually independent of curing agent and was attributed to etherification taking place in the epoxy excess mixtures. © 1994 John Wiley & Sons, Inc.
ISSN:0021-8995
1097-4628
DOI:10.1002/app.1994.070530406