Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources

Dendrite growth and the method of preventing the dendrite growth in nickel electroplating were studied on photochemically etched patterns of vapor depositing copper using a 99.99mass% (4N) copper source. Soft chemical etching and increasing the plating power source ripple were found to be effective...

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Veröffentlicht in:	Hyōmen gijutsu 1997/05/01, Vol.48(5), pp.539-543
1. Verfasser:	MITA, Mamoru
Format:	Artikel
Sprache:	eng ; jpn
Schlagworte:	Electro plating High purity Copper Thin film Vapor deposition
Online-Zugang:	Volltext
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