Plating Characteristics of Vapor Deposited Copper Film Using High Purity Copper Sources

Dendrite growth and the method of preventing the dendrite growth in nickel electroplating were studied on photochemically etched patterns of vapor depositing copper using a 99.99mass% (4N) copper source. Soft chemical etching and increasing the plating power source ripple were found to be effective in preventing the dendrite growth. No dendrite growth with copper pattern formed using a 6N copper source or rolled or electrodeposited copper foil. It was found that copper patterns formed with a 6N copper source had higher resistivity in high temperature and high humidity testing than patterns formed with a 4N copper source.