Molecular-beam epitaxial growth and high-temperature performance of HgCdTe midwave infrared detectors

Results are reported on the molecular-beam epitaxial (MBE) growth and electrical performance of HgCdTe midwave-infrared (MWIR) detector structures. These devices are designed for operation in the 140–160 K temperature range with cutoff wavelengths ranging from 3.4–3.8 µm at 140 K. Epitaxial structures, grown at 185°C on (211)B-oriented CdZnTe substrates, consisting of either conventional two-layer P-n configurations or three-layer P-n-N configurations, were designed to examine the impact of device performance on variation of the n-type base layer (absorber) thickness and the inclusion or omission of an underlying wide-bandgap buffer layer. Devices were grown with absorber thicknesses of 3 µm, 5 µm, and 7 µm to examine the tradeoff between the spectral response characteristic and the reverse-bias electrical performance. In addition, 5-µm-thick, wide-bandgap HgCdTe buffer layers, whose CdTe mole fraction was approximately 0.1 larger than the absorber layer, were introduced into several device structures to study the effect of isolating the device absorbing layer from the substrate/growth initiation interface. The MBE-grown epitaxial wafers were processed into passivated, mesa-type, discrete device structures and diode mini arrays, which were tested for temperature-dependent R0A product, quantum efficiency, spectral response, and the I-V characteristic at temperatures close to 140 K. External quantum efficiencies of 75–79% were obtained with lateral optical-collection lengths of 7 µm. Analysis of the temperature dependence of the diode R0A product indicates that the device impedance is limited by the diffusion current at temperatures above 140 K with typical R0A values of 2×106 Ω cm2 for a detector cutoff of 3.8 µm at 140 K. An alloy composition anomaly at the absorbing-layer/buffer-layer interface is believed to limit the observed R0A products to values approximately one order of magnitude below the theoretical limit projected for radiatively limited carrier lifetime. Device electrical performance was observed to be improved through incorporation of a wide-bandgap buffer layer and through reduction of the absorbing layer thickness. An optimum spectral response characteristic was observed for device structures with 5-µm-thick absorbing layers.