Chemical fluid deposition: a hybrid technique for low-temeprature metallization

Chemical fluid deposition: a hybrid technique for low-temeprature metallization

Metal deposition from supercritical CO sub 2 combines the advantages of chemical vapor deposition and aqueous plating without the drawbacks of high temperatures and toxic by-products. This general technique exploits the near- liquid densities and gas-like transport properties of the fluid, and has s...

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Veröffentlicht in:Advanced materials (Weinheim) 2000-06, Vol.12 (12), p.913-915
Hauptverfasser: Long, D P, Blackburn, J M, Watkins, J J
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creator Long, D P
Blackburn, J M
Watkins, J J
description Metal deposition from supercritical CO sub 2 combines the advantages of chemical vapor deposition and aqueous plating without the drawbacks of high temperatures and toxic by-products. This general technique exploits the near- liquid densities and gas-like transport properties of the fluid, and has successfully been used to deposit bright, reflective films of Pt, Pd, Au, and Rh. Substrates include polyimide.
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title Chemical fluid deposition: a hybrid technique for low-temeprature metallization
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