Chemical fluid deposition: a hybrid technique for low-temeprature metallization
Metal deposition from supercritical CO sub 2 combines the advantages of chemical vapor deposition and aqueous plating without the drawbacks of high temperatures and toxic by-products. This general technique exploits the near- liquid densities and gas-like transport properties of the fluid, and has s...
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Veröffentlicht in: | Advanced materials (Weinheim) 2000-06, Vol.12 (12), p.913-915 |
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Hauptverfasser: | , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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Zusammenfassung: | Metal deposition from supercritical CO sub 2 combines the advantages of chemical vapor deposition and aqueous plating without the drawbacks of high temperatures and toxic by-products. This general technique exploits the near- liquid densities and gas-like transport properties of the fluid, and has successfully been used to deposit bright, reflective films of Pt, Pd, Au, and Rh. Substrates include polyimide. |
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ISSN: | 0935-9648 |