Modular, portable, and easily simulated ESD protection networks for advanced CMOS technologies

Modular, portable, and easily simulated ESD protection networks for advanced CMOS technologies

This paper introduces a new distributed active MOSFET rail clamp network that offers surprising advantages in layout area efficiency, bus resistance tolerance, design modularity, and ease of reuse. SPICE simulation results using an extended vertical PNP bipolar transistor compact model and a new met...

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Veröffentlicht in:Microelectronics and reliability 2002-06, Vol.42 (6), p.873-885
Hauptverfasser: Torres, Cynthia A., Miller, James W., Stockinger, Michael, Akers, Matthew D., Khazhinsky, Michael G., Weldon, James C.
Format: Artikel
Sprache:eng
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Zusammenfassung:This paper introduces a new distributed active MOSFET rail clamp network that offers surprising advantages in layout area efficiency, bus resistance tolerance, design modularity, and ease of reuse. SPICE simulation results using an extended vertical PNP bipolar transistor compact model and a new method for optimizing distributed rail clamp networks are presented along with chip-level test results.
ISSN:0026-2714
1872-941X
DOI:10.1016/S0026-2714(02)00051-3