Effect of tartrate content on aging and deposition condition of copper–tin electrodeposits from a non-cyanide acid bath

The effect of the presence of tartrate additive on the chemical stability of a Cu–Sn acid bath was evaluated. It was observed that this additive hinders decomposition of the Cu/Sn deposition bath with storage time, since the decrease in electrochemical efficiency was attenuated. In addition, it was...

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Veröffentlicht in:	Surface & coatings technology 2002-08, Vol.157 (1), p.14-18
Hauptverfasser:	Carlos, I.A, Bidoia, E.D, Pallone, E.M.J.A, Almeida, M.R.H, Souza, C.A.C
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Copper–tin alloy Cross-disciplinary physics: materials science rheology Electrodeposition, electroplating Electroplating Exact sciences and technology Materials science Metals. Metallurgy Methods of deposition of films and coatings film growth and epitaxy Physics Tartrate
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