Effect of tartrate content on aging and deposition condition of copper–tin electrodeposits from a non-cyanide acid bath
The effect of the presence of tartrate additive on the chemical stability of a Cu–Sn acid bath was evaluated. It was observed that this additive hinders decomposition of the Cu/Sn deposition bath with storage time, since the decrease in electrochemical efficiency was attenuated. In addition, it was...
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| Veröffentlicht in: | Surface & coatings technology 2002-08, Vol.157 (1), p.14-18 |
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| container_title | Surface & coatings technology |
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| creator | Carlos, I.A Bidoia, E.D Pallone, E.M.J.A Almeida, M.R.H Souza, C.A.C |
| description | The effect of the presence of tartrate additive on the chemical stability of a Cu–Sn acid bath was evaluated. It was observed that this additive hinders decomposition of the Cu/Sn deposition bath with storage time, since the decrease in electrochemical efficiency was attenuated. In addition, it was observed that optimal galvanostatic deposition with or without tartrate occurs at approximately 11 mA cm
−2. However, in the presence of tartrate the deposition charge was lower, leading to lower energy consumption. SEM analysis showed that the tartrate added to the plating bath caused a marked change in the morphology of the Cu/Sn films obtained galvanostatically. |
| doi_str_mv | 10.1016/S0257-8972(02)00139-1 |
| format | Article |
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| source | Elsevier ScienceDirect Journals Complete |
| subjects | Applied sciences Copper–tin alloy Cross-disciplinary physics: materials science rheology Electrodeposition, electroplating Electroplating Exact sciences and technology Materials science Metals. Metallurgy Methods of deposition of films and coatings film growth and epitaxy Physics Tartrate |
| title | Effect of tartrate content on aging and deposition condition of copper–tin electrodeposits from a non-cyanide acid bath |
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