A review of narrow-channel effects for STI MOSFET's: A difference between surface- and buried-channel cases
The shallow trench isolation (STI) is one of the key technologies for VLSI. The threshold voltage V th for surface-channel STI MOSFET's becomes lower with decreasing channel width W, which is called the inverse narrow-channel effect (INCE). Also, there is a hump in the subthreshold characterist...
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Veröffentlicht in: | Solid-state electronics 1999-11, Vol.43 (11), p.2061-2066 |
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Hauptverfasser: | , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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Zusammenfassung: | The shallow trench isolation (STI) is one of the key technologies for VLSI. The threshold voltage
V
th for surface-channel STI MOSFET's becomes lower with decreasing channel width
W, which is called the
inverse narrow-channel effect (INCE). Also, there is a hump in the subthreshold characteristic. On the contrary, buried-channel STI MOSFET's reveal a conventional narrow-channel effect. Also, there is no hump in the subthreshold characteristic.
This paper reviews above phenomena with a
consistent explanation for the surface- and buried-channel STI MOSFET's. Countermeasures for INCE are also discussed. |
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ISSN: | 0038-1101 1879-2405 |
DOI: | 10.1016/S0038-1101(99)00157-4 |