Preparation, solubility and thermal behaviour of new bismaleimides containing silicone linkages

A series of new bismaleimides containing silicone linkages have been prepared via Diels–Alder reaction of bismaleimides containing silicone and bisfurans containing silicone; their molecular structures have been characterized by FTIR, NMR and elemental analysis. The solubility of the prepared bismaleimides was tested in six types of solvent of different boiling point and polarity, and their curing temperatures were determined by DSC. The thermal‐oxidative stability of the cured networks was investigated by TGA and their glass transition temperatures were measured by DSC, revealing that the bismaleimides are soluble in low boiling point solvents and their curing temperatures are in the range 206–285°C. The DSC and TGA traces of cured networks show that the glass transition temperatures are in the range 287–331°C and that these resins are stable up to 353–384°C. © 1999 Society of Chemical Industry