Material property, compatibility, and reliability issues in diamond-enhanced, GaAs-based plastic packages
GaAs MESFET (chip&wire and flip-chip) and PHEMT devices were plastic-packaged using CVD diamond (CVDD) in SOIC and QFP geometries, respectively. The compatibility of CVDD insertion was considered with respect to thermal, thermo-mechanical, and chemical properties as well as spatial arrangement a...
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Veröffentlicht in: | Microelectronics and reliability 1999, Vol.39 (8), p.1275-1291 |
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Format: | Artikel |
Sprache: | eng |
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