Material property, compatibility, and reliability issues in diamond-enhanced, GaAs-based plastic packages

GaAs MESFET (chip&wire and flip-chip) and PHEMT devices were plastic-packaged using CVD diamond (CVDD) in SOIC and QFP geometries, respectively. The compatibility of CVDD insertion was considered with respect to thermal, thermo-mechanical, and chemical properties as well as spatial arrangement a...

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Veröffentlicht in:Microelectronics and reliability 1999, Vol.39 (8), p.1275-1291
1. Verfasser: Fabis, Philip M.
Format: Artikel
Sprache:eng
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