Relaxed silicon-germanium on insulator substrate by layer transfer

The fabrication of 4 in. relaxed Si sub(1-x)Ge sub(x)-on-insulator (SGOI) substrates by layer transfer was demonstrated. A high-quality relaxed Si sub(1-x )Ge sub(x) layer was grown using ultrahigh vacuum chemical vapor deposition (UHVCVD) on 4 in. Si donor wafers. Thin Si sub(1-x)Ge sub(x) film (x...

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Veröffentlicht in:Journal of electronic materials 2001-12, Vol.30 (12), p.L37-L39
Hauptverfasser: ZHIYUAN CHENG, TARASCHI, Gianni, CURRIE, Matthew T, LEITZ, Chris W, LEE, Minjoo L, PITERA, Arthur, LANGDO, Thomas A, HOYT, Judy L, ANTONIADIS, Dimitri A, FITZGERALD, Eugene A
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container_end_page L39
container_issue 12
container_start_page L37
container_title Journal of electronic materials
container_volume 30
creator ZHIYUAN CHENG
TARASCHI, Gianni
CURRIE, Matthew T
LEITZ, Chris W
LEE, Minjoo L
PITERA, Arthur
LANGDO, Thomas A
HOYT, Judy L
ANTONIADIS, Dimitri A
FITZGERALD, Eugene A
description The fabrication of 4 in. relaxed Si sub(1-x)Ge sub(x)-on-insulator (SGOI) substrates by layer transfer was demonstrated. A high-quality relaxed Si sub(1-x )Ge sub(x) layer was grown using ultrahigh vacuum chemical vapor deposition (UHVCVD) on 4 in. Si donor wafers. Thin Si sub(1-x)Ge sub(x) film (x = 0.2 or 0.25) was then transferred onto an oxidized Si handle wafer by bonding and wafer splitting using hydrogen implantation. The resulting relaxed SGOI structures were characterized by transmission electron microscopy (TEM) and atomic force microscopy (AFM).
doi_str_mv 10.1007/s11664-001-0182-0
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subjects Applied sciences
Electronics
Exact sciences and technology
Microelectronic fabrication (materials and surfaces technology)
Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices
title Relaxed silicon-germanium on insulator substrate by layer transfer
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