Scanning thermal microscopy studies of local temperature distribution of micron-sized metallization lines

The scanning thermal microscope (SThM) was used to measure the surface temperature distribution and surface morphology of micron-sized Al–Si–Cu metallization lines which was in situ electrically heated for SThM dynamical measurements. The local temperature along micron-sized lines was detected by a thin film thermistor tip of the SThM for determining the electromigration lifetime of metallization system of micro-electronic devices. The thermal image contrast was mainly due to the temperature distribution. The temperature difference along the metal line was 1.75 °C, which was in good agreement with that obtained by the infrared emission microscope.