Nano-indentation studies of xerogel and SiLK low-K dielectric materials

Low-K dielectric films have reduced hardness and modulus relative to traditional dielectric materials. There are many potential challenges associated with these materials to integrate with integrated circuit (IC) technologies. It is important to evaluate the mechanical properties of low-K materials...

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Veröffentlicht in:	Journal of electronic materials 2001-12, Vol.30 (12), p.1527-1531
Hauptverfasser:	Sikder, A. K., Irfan, I. M., Kumar, Ashok, Anthony, J. M.
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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