Nanoscale patterning of self-assembled monolayers by e-beam lithography

The resolution of e-beam lithography in standard resists is limited by the size of the molecules in the resist. High resolution e-beam resists therefore should not only show a specific sensitivity to electrons but also be thin and composed of small subunits. Self-assembled monolayers (SAMs) fulfil t...

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Veröffentlicht in:Microelectronic engineering 2001-09, Vol.57, p.903-907
Hauptverfasser: Weimann, Thomas, Geyer, Wolfgang, Hinze, Peter, Stadler, Volker, Eck, Wolfgang, Gölzhäuser, Armin
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Sprache:eng
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Zusammenfassung:The resolution of e-beam lithography in standard resists is limited by the size of the molecules in the resist. High resolution e-beam resists therefore should not only show a specific sensitivity to electrons but also be thin and composed of small subunits. Self-assembled monolayers (SAMs) fulfil these criteria because they are homogeneous, highly ordered films of amphiphilic molecules with a typical thickness of 1–2 nm and an intermolecular spacing of 1–0.5 nm. We demonstrate that gold nanostructures can be fabricated using aliphatic and aromatic thiol self-assembled monolayers as positive and negative electron beam resists.
ISSN:0167-9317
1873-5568
DOI:10.1016/S0167-9317(01)00454-3