Nanoscale patterning of self-assembled monolayers by e-beam lithography
The resolution of e-beam lithography in standard resists is limited by the size of the molecules in the resist. High resolution e-beam resists therefore should not only show a specific sensitivity to electrons but also be thin and composed of small subunits. Self-assembled monolayers (SAMs) fulfil t...
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Veröffentlicht in: | Microelectronic engineering 2001-09, Vol.57, p.903-907 |
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Hauptverfasser: | , , , , , |
Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | The resolution of e-beam lithography in standard resists is limited by the size of the molecules in the resist. High resolution e-beam resists therefore should not only show a specific sensitivity to electrons but also be thin and composed of small subunits. Self-assembled monolayers (SAMs) fulfil these criteria because they are homogeneous, highly ordered films of amphiphilic molecules with a typical thickness of 1–2 nm and an intermolecular spacing of 1–0.5 nm. We demonstrate that gold nanostructures can be fabricated using aliphatic and aromatic thiol self-assembled monolayers as positive and negative electron beam resists. |
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ISSN: | 0167-9317 1873-5568 |
DOI: | 10.1016/S0167-9317(01)00454-3 |