Inter-diffusion and nitrogen absorption in Pd/Ti/SiO2/Si multi-layer system
The development of automotive electronics and avionics requires that some electronic devices or sensors be capable of withstanding high temperatures (300 C or higher). This brings many new problems to the electronic interconnections and related materials. The Pd /Ti multilayer thin-film couple is th...
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| Veröffentlicht in: | Journal of materials science letters 2001-05, Vol.20 (10), p.911-912 |
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| container_title | Journal of materials science letters |
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| creator | LIGUANG DU AHAT, Shawkret MEI SHENG ZHIGOU SUN WEIDONG HUANG LE LUO |
| description | The development of automotive electronics and avionics requires that some electronic devices or sensors be capable of withstanding high temperatures (300 C or higher). This brings many new problems to the electronic interconnections and related materials. The Pd /Ti multilayer thin-film couple is thought to be a potential candidate as a bonding pad material for its good stability at high temperatures. In this study, the inter-diffusion between Pd/Ti layers and the reaction of the multi-metal layers with ambient gases was investigated by measuring the in-situ resistivity change of the film at 300 C. The results clearly demonstrate that nitrogen enters the multilayer and affects resistivity. (CSA) |
| doi_str_mv | 10.1023/A:1010976716157 |
| format | Article |
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This brings many new problems to the electronic interconnections and related materials. The Pd /Ti multilayer thin-film couple is thought to be a potential candidate as a bonding pad material for its good stability at high temperatures. In this study, the inter-diffusion between Pd/Ti layers and the reaction of the multi-metal layers with ambient gases was investigated by measuring the in-situ resistivity change of the film at 300 C. The results clearly demonstrate that nitrogen enters the multilayer and affects resistivity. 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| ispartof | Journal of materials science letters, 2001-05, Vol.20 (10), p.911-912 |
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| subjects | Chemical interdiffusion diffusion barriers Condensed matter: structure, mechanical and thermal properties Diffusion in solids Diffusion interface formation Exact sciences and technology Low-dimensional structures (superlattices, quantum well structures, multilayers): structure, and nonelectronic properties Physics Solid surfaces and solid-solid interfaces Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) Transport properties of condensed matter (nonelectronic) |
| title | Inter-diffusion and nitrogen absorption in Pd/Ti/SiO2/Si multi-layer system |
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