The use of reliability factors in analyzing powder patterns in Pt–Si sputtering targets and subsequent films

The use of reliability factors in analyzing powder patterns in Pt–Si sputtering targets and subsequent films

X-ray powder diffraction was used to characterize a Pt–Si sputtering target and subsequent films. The powder patterns of each sample indicated lines due to diffraction from different phases. We have initiated a preliminary study through which we have analyzed and characterized these films. The resul...

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Veröffentlicht in:Journal of Materials Research 1998-06, Vol.13 (6), p.1517-1521
Hauptverfasser: Rahman, Abdul, Lowe, Walter P., Bates, Clayton W.
Format: Artikel
Sprache:eng
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MATERIALS SCIENCE
PHASE STUDIES
PLATINUM SILICIDES
POWDERS
SPUTTERING
X-RAY DIFFRACTION
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container_issue 6
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container_title Journal of Materials Research
container_volume 13
creator Rahman, Abdul
Lowe, Walter P.
Bates, Clayton W.
description X-ray powder diffraction was used to characterize a Pt–Si sputtering target and subsequent films. The powder patterns of each sample indicated lines due to diffraction from different phases. We have initiated a preliminary study through which we have analyzed and characterized these films. The results presented for these samples corroborate with results observed for this system in the planar configuration.
doi_str_mv 10.1557/JMR.1998.0211
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subjects MATERIALS SCIENCE
PHASE STUDIES
PLATINUM SILICIDES
POWDERS
SPUTTERING
X-RAY DIFFRACTION
title The use of reliability factors in analyzing powder patterns in Pt–Si sputtering targets and subsequent films
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