The use of reliability factors in analyzing powder patterns in Pt–Si sputtering targets and subsequent films

X-ray powder diffraction was used to characterize a Pt–Si sputtering target and subsequent films. The powder patterns of each sample indicated lines due to diffraction from different phases. We have initiated a preliminary study through which we have analyzed and characterized these films. The results presented for these samples corroborate with results observed for this system in the planar configuration.