A mechanical assessment of flexible optoelectronic devices
This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to e...
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| Veröffentlicht in: | Thin solid films 2001-08, Vol.394 (1-2), p.202-206 |
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| container_end_page | 206 |
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| container_issue | 1-2 |
| container_start_page | 202 |
| container_title | Thin solid films |
| container_volume | 394 |
| creator | ZHONG CHEN COTTERELL, Brian WEI WANG GUENTHER, Ewald CHUA, Soo-Jin |
| description | This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to estimate the thin film fracture toughness and film delamination toughness. These values serve as design parameters on the device flexibility and reliability. copyright 2001 Elsevier Science B.V. All rights resered. |
| format | Article |
| fullrecord | <record><control><sourceid>proquest_pasca</sourceid><recordid>TN_cdi_proquest_miscellaneous_26786200</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>26786200</sourcerecordid><originalsourceid>FETCH-LOGICAL-p600-727f8cde54e7e7aab7a1c463bfa0152abb5d8c67e925e5317f3706109ee9a0153</originalsourceid><addsrcrecordid>eNotz01LxDAUheEgCtbR_5CFuCvcJG3SuBsGPwYG3My-3KY3WEk_7O2I_nsrzupsHg68FyJTlfO5dkZdigyggNyCh2txw_wBAEprk4nHrewpvOPQBUwSmYm5p2GRY5Qx0XfXJJLjtIyUKCzzuDrZ0lcXiG_FVcTEdHfejTg-Px13r_nh7WW_2x7yyQLkTrtYhZbKghw5xMahCoU1TURQpcamKdsqWEdel1Qa5aJxYBV4Iv8nzEY8_N9O8_h5Il7qvuNAKeFA44lrbV1lNcAK788QeY2JMw6h43qaux7nn1pB5bWuzC9Y4FIk</addsrcrecordid><sourcetype>Aggregation Database</sourcetype><iscdi>true</iscdi><recordtype>article</recordtype><pqid>26786200</pqid></control><display><type>article</type><title>A mechanical assessment of flexible optoelectronic devices</title><source>Elsevier ScienceDirect Journals</source><creator>ZHONG CHEN ; COTTERELL, Brian ; WEI WANG ; GUENTHER, Ewald ; CHUA, Soo-Jin</creator><creatorcontrib>ZHONG CHEN ; COTTERELL, Brian ; WEI WANG ; GUENTHER, Ewald ; CHUA, Soo-Jin</creatorcontrib><description>This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to estimate the thin film fracture toughness and film delamination toughness. These values serve as design parameters on the device flexibility and reliability. copyright 2001 Elsevier Science B.V. All rights resered.</description><identifier>ISSN: 0040-6090</identifier><identifier>EISSN: 1879-2731</identifier><identifier>CODEN: THSFAP</identifier><language>eng</language><publisher>Lausanne: Elsevier Science</publisher><subject>Applied sciences ; Condensed matter: structure, mechanical and thermal properties ; Electronics ; Exact sciences and technology ; Mechanical and acoustical properties ; Optoelectronic devices ; Physical properties of thin films, nonelectronic ; Physics ; Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices ; Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><ispartof>Thin solid films, 2001-08, Vol.394 (1-2), p.202-206</ispartof><rights>2001 INIST-CNRS</rights><lds50>peer_reviewed</lds50><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><link.rule.ids>314,777,781</link.rule.ids><backlink>$$Uhttp://pascal-francis.inist.fr/vibad/index.php?action=getRecordDetail&idt=1089228$$DView record in Pascal Francis$$Hfree_for_read</backlink></links><search><creatorcontrib>ZHONG CHEN</creatorcontrib><creatorcontrib>COTTERELL, Brian</creatorcontrib><creatorcontrib>WEI WANG</creatorcontrib><creatorcontrib>GUENTHER, Ewald</creatorcontrib><creatorcontrib>CHUA, Soo-Jin</creatorcontrib><title>A mechanical assessment of flexible optoelectronic devices</title><title>Thin solid films</title><description>This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to estimate the thin film fracture toughness and film delamination toughness. These values serve as design parameters on the device flexibility and reliability. copyright 2001 Elsevier Science B.V. All rights resered.</description><subject>Applied sciences</subject><subject>Condensed matter: structure, mechanical and thermal properties</subject><subject>Electronics</subject><subject>Exact sciences and technology</subject><subject>Mechanical and acoustical properties</subject><subject>Optoelectronic devices</subject><subject>Physical properties of thin films, nonelectronic</subject><subject>Physics</subject><subject>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</subject><subject>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</subject><issn>0040-6090</issn><issn>1879-2731</issn><fulltext>true</fulltext><rsrctype>article</rsrctype><creationdate>2001</creationdate><recordtype>article</recordtype><recordid>eNotz01LxDAUheEgCtbR_5CFuCvcJG3SuBsGPwYG3My-3KY3WEk_7O2I_nsrzupsHg68FyJTlfO5dkZdigyggNyCh2txw_wBAEprk4nHrewpvOPQBUwSmYm5p2GRY5Qx0XfXJJLjtIyUKCzzuDrZ0lcXiG_FVcTEdHfejTg-Px13r_nh7WW_2x7yyQLkTrtYhZbKghw5xMahCoU1TURQpcamKdsqWEdel1Qa5aJxYBV4Iv8nzEY8_N9O8_h5Il7qvuNAKeFA44lrbV1lNcAK788QeY2JMw6h43qaux7nn1pB5bWuzC9Y4FIk</recordid><startdate>20010815</startdate><enddate>20010815</enddate><creator>ZHONG CHEN</creator><creator>COTTERELL, Brian</creator><creator>WEI WANG</creator><creator>GUENTHER, Ewald</creator><creator>CHUA, Soo-Jin</creator><general>Elsevier Science</general><scope>IQODW</scope><scope>7SP</scope><scope>7U5</scope><scope>8FD</scope><scope>L7M</scope></search><sort><creationdate>20010815</creationdate><title>A mechanical assessment of flexible optoelectronic devices</title><author>ZHONG CHEN ; COTTERELL, Brian ; WEI WANG ; GUENTHER, Ewald ; CHUA, Soo-Jin</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-LOGICAL-p600-727f8cde54e7e7aab7a1c463bfa0152abb5d8c67e925e5317f3706109ee9a0153</frbrgroupid><rsrctype>articles</rsrctype><prefilter>articles</prefilter><language>eng</language><creationdate>2001</creationdate><topic>Applied sciences</topic><topic>Condensed matter: structure, mechanical and thermal properties</topic><topic>Electronics</topic><topic>Exact sciences and technology</topic><topic>Mechanical and acoustical properties</topic><topic>Optoelectronic devices</topic><topic>Physical properties of thin films, nonelectronic</topic><topic>Physics</topic><topic>Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices</topic><topic>Surfaces and interfaces; thin films and whiskers (structure and nonelectronic properties)</topic><toplevel>peer_reviewed</toplevel><toplevel>online_resources</toplevel><creatorcontrib>ZHONG CHEN</creatorcontrib><creatorcontrib>COTTERELL, Brian</creatorcontrib><creatorcontrib>WEI WANG</creatorcontrib><creatorcontrib>GUENTHER, Ewald</creatorcontrib><creatorcontrib>CHUA, Soo-Jin</creatorcontrib><collection>Pascal-Francis</collection><collection>Electronics & Communications Abstracts</collection><collection>Solid State and Superconductivity Abstracts</collection><collection>Technology Research Database</collection><collection>Advanced Technologies Database with Aerospace</collection><jtitle>Thin solid films</jtitle></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext</fulltext></delivery><addata><au>ZHONG CHEN</au><au>COTTERELL, Brian</au><au>WEI WANG</au><au>GUENTHER, Ewald</au><au>CHUA, Soo-Jin</au><format>journal</format><genre>article</genre><ristype>JOUR</ristype><atitle>A mechanical assessment of flexible optoelectronic devices</atitle><jtitle>Thin solid films</jtitle><date>2001-08-15</date><risdate>2001</risdate><volume>394</volume><issue>1-2</issue><spage>202</spage><epage>206</epage><pages>202-206</pages><issn>0040-6090</issn><eissn>1879-2731</eissn><coden>THSFAP</coden><abstract>This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to estimate the thin film fracture toughness and film delamination toughness. These values serve as design parameters on the device flexibility and reliability. copyright 2001 Elsevier Science B.V. All rights resered.</abstract><cop>Lausanne</cop><pub>Elsevier Science</pub><tpages>5</tpages></addata></record> |
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| ispartof | Thin solid films, 2001-08, Vol.394 (1-2), p.202-206 |
| issn | 0040-6090 1879-2731 |
| language | eng |
| recordid | cdi_proquest_miscellaneous_26786200 |
| source | Elsevier ScienceDirect Journals |
| subjects | Applied sciences Condensed matter: structure, mechanical and thermal properties Electronics Exact sciences and technology Mechanical and acoustical properties Optoelectronic devices Physical properties of thin films, nonelectronic Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties) |
| title | A mechanical assessment of flexible optoelectronic devices |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-19T02%3A30%3A53IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-proquest_pasca&rft_val_fmt=info:ofi/fmt:kev:mtx:journal&rft.genre=article&rft.atitle=A%20mechanical%20assessment%20of%20flexible%20optoelectronic%20devices&rft.jtitle=Thin%20solid%20films&rft.au=ZHONG%20CHEN&rft.date=2001-08-15&rft.volume=394&rft.issue=1-2&rft.spage=202&rft.epage=206&rft.pages=202-206&rft.issn=0040-6090&rft.eissn=1879-2731&rft.coden=THSFAP&rft_id=info:doi/&rft_dat=%3Cproquest_pasca%3E26786200%3C/proquest_pasca%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_pqid=26786200&rft_id=info:pmid/&rfr_iscdi=true |