A mechanical assessment of flexible optoelectronic devices

This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to e...

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Veröffentlicht in:	Thin solid films 2001-08, Vol.394 (1-2), p.202-206
Hauptverfasser:	ZHONG CHEN, COTTERELL, Brian, WEI WANG, GUENTHER, Ewald, CHUA, Soo-Jin
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Condensed matter: structure, mechanical and thermal properties Electronics Exact sciences and technology Mechanical and acoustical properties Optoelectronic devices Physical properties of thin films, nonelectronic Physics Semiconductor electronics. Microelectronics. Optoelectronics. Solid state devices Surfaces and interfaces thin films and whiskers (structure and nonelectronic properties)
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Beschreibung
Zusammenfassung:	This work has demonstrated novel experimental methods and their relevant analysis to evaluate the fracture properties of thin brittle films on compliant substrates for flexible optoelectronic devices. Based on the understanding of the failure mechanisms, mechanical calculation has been provided to estimate the thin film fracture toughness and film delamination toughness. These values serve as design parameters on the device flexibility and reliability. copyright 2001 Elsevier Science B.V. All rights resered.
ISSN:	0040-6090 1879-2731