Effect of milling process on core-shell microstructure and electrical properties for BaTiO3-based Ni-MLCC

The effects of milling process parameters on the microstructural evolution and electrical properties of multilayer ceramic capacitor (MLCC) samples were investigated in the BaTiO3 (BT)-Ho2O3-MgO system. The microstructure for samples fired at 1320 C was dependent on the degree of damage introduced by the milling process. The mean grain size (D50) determined from the chemically etched samples decreased as the damage increased. The endothermic peak of a DSC profile at around 125 C was broadened and the peak area decreased as the damage increased. Furthermore, the electrical properties were also dependent on the degree of damage with increasing damage, the dielectric constant decreased and the peak at around room temperature shifted to a higher temperature. In addition, it was found that the samples showed small leakage current and a long mean lifetime. 7 refs.