Dynamic embrittlement of Cu–Sn bicrystals grown from the melt

Bicrystals of Cu–8%Sn grown from the melt to make a Σ=5 (0 3 1)[0 0 1] symmetrical tilt boundary were found to be very difficult to crack by dynamic embrittlement, even along the fast-diffusion direction, in contrast with earlier results on bicrystals made by diffusion bonding that contained particles in the boundary. This has implications for the role of particles and the tendency for cracking in low- Σ boundaries.