Crack growth in alumina at high temperature

The trailing fracture process zone associated with stable crack growth at room and elevated temperature in high density polycrystalline alumina was analyzed by a hybrid experimental-numerical procedure. The experimental and numerical procedures involved moiré interferometry and finite element analyses, respectfully. The crack bridging stress and the dissipated energy in the fracture process zone were determined at room temperature, 600°C, 800°C and 1000°C. Both quantities decreased at elevated temperature due to grain boundary sliding.