Influence of silicon crystal defects and contamination on the electrical behavior of power devices

Since power devices require a thick electrically active n-type silicon layer with high resistivity and a large area, their electrical characteristics are extremely sensitive to contamination. If heavy metals diffuse into the silicon wafers during the high-temperature steps, an uncontrolled increase in the leakage current and the on-state voltage can be observed. Furthermore, current filamentation and instabilities of the electrical data can occur. It turned out that the optimization of the cleaning processes, high-temperature steps and gettering treatments alone is not sufficient to avoid such effects. It is also important to avoid silicon crystal defects by proper processing. A dramatic increase in the leakage current was correlated with the appearance of silicon defects decorated with heavy metals. As a consequence of the low doping level of the n-base, the blocking voltage and the failure rate due to cosmic radiation are sensitive to contaminating atoms acting as donors.