Characterization of undoped and Cu-doped ZnO films for surface acoustic wave applications

Cu-doped ZnO (denoted by ZnO:Cu) films have been prepared by RF magnetron co-sputtering of a ZnO target with some Cu-chips attached. X-Ray diffraction (XRD) spectra of deposited ZnO:Cu films were measured and texture coefficient (TC) values for (002)-orientation were estimated. Optimal ranges of RF...

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Veröffentlicht in:Thin solid films 2001-11, Vol.398, p.641-646
Hauptverfasser: Lee, Jin-Bock, Lee, Hye-Jung, Seo, Soo-Hyung, Park, Jin-Seok
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Sprache:eng
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Zusammenfassung:Cu-doped ZnO (denoted by ZnO:Cu) films have been prepared by RF magnetron co-sputtering of a ZnO target with some Cu-chips attached. X-Ray diffraction (XRD) spectra of deposited ZnO:Cu films were measured and texture coefficient (TC) values for (002)-orientation were estimated. Optimal ranges of RF powers and substrate temperatures for obtaining high TC values were determined. Effects of Cu-doping conditions (such as Cu-chip sputtering areas and O 2/(Ar+O 2) mixing ratios) on TC values, electrical resistivities, and relative Cu-compositions of deposited films have been systematically investigated. X-Ray photoelectron spectroscopy (XPS) study suggests that the relative densities of metallic copper (Cu 0) atoms and CuO (Cu 2+)-phases within deposited films may play an important role in determining their electrical resistivities. Highly resistive (>10 10 Ωcm) ZnO films with high TC values (>80%) can be achieved by Cu-doping. Surface acoustic wave (SAW) devices with ZnO:Cu (or ZnO)/interdigital transducer (IDT)/SiO 2/Si configuration were also fabricated to estimate the effective electro-mechanical coupling coefficient ( k eff 2) and insertion loss. The devices using Cu-doped ZnO films have higher k eff 2 and lower insertion loss, compared with those using undoped films.
ISSN:0040-6090
1879-2731
DOI:10.1016/S0040-6090(01)01332-3