Effects of mixing temperature on the extrusion rheological behaviors of rubber-based compounds

In this study, rim strip (R) and sidewall (S) compounds were prepared at varying initial mixing temperatures. The effects of the mixing temperature on the extrusion rheological behaviors of the compounds were investigated, and the relationships between the compound structure and the extrusion rheolo...

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Veröffentlicht in:RSC advances 2021-10, Vol.11 (56), p.3573-3571
Hauptverfasser: Du, Zhongjin, Du, Yu, Gong, Yankun, Liu, Guizhi, Li, Zhuo, Yu, Guangshui, Zhao, Shugao
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Sprache:eng
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Zusammenfassung:In this study, rim strip (R) and sidewall (S) compounds were prepared at varying initial mixing temperatures. The effects of the mixing temperature on the extrusion rheological behaviors of the compounds were investigated, and the relationships between the compound structure and the extrusion rheological behaviors were studied. The results showed that the tensile stress relaxation rates of both R and S were more sensitive to the mixing temperature than the shear stress relaxation rate, and the former was affected by both the dispersion of carbon black (CB) and the actual molecular weight of the rubbers. Strain sweep results showed that R, which had a higher CB content, had a more obvious Payne effect than S. When the initial mixing temperature increased from 80 °C to 90 °C, both storage modulus ( G ′) at a low shear strain and the Δ G ′ of R obviously decreased, indicating CB dispersion improvement. The S extrudates showed higher die swell ratios (B) than the R extrudates, and the former was more sensitive to mixing temperature. The main factors influencing the B of the R and S were the CB dispersity and the molecular weight, respectively. In addition, at high extrusion rates, a sharkskin phenomenon could be observed for the R extrudate surfaces, whereas the S extrudates were more likely to be integrally distorted. The carbon black dispersity and rubber molecular weight change during the mixing process were the important factors determining the die swell behavior of the rubber compounds.
ISSN:2046-2069
2046-2069
DOI:10.1039/d1ra05929g