Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling

Coax via-A technique to reduce crosstalk and enhance impedance match at vias in high-frequency multilayer packages verified by FDTD and MoM modeling

Large-scale crosstalk at vias and poor via electrical performance are major drawbacks in state-of-the-art high-frequency multilayer first- or second-level integrated-circuit/monolithic-microwave integrated-circuit (IC/MMIC) packages. The coax via design modeled in this paper breaks new ground in ach...

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Veröffentlicht in:IEEE transactions on microwave theory and techniques 1997-10, Vol.45 (10), p.1981-1985
1. Verfasser: Pillai, E.R.
Format: Artikel
Sprache:eng
Schlagworte:
Coaxial components
Crosstalk
Finite difference methods
Impedance
Integrated circuit modeling
Integrated circuit packaging
Microstrip
Nonhomogeneous media
Stripline
Time domain analysis
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Zusammenfassung:Large-scale crosstalk at vias and poor via electrical performance are major drawbacks in state-of-the-art high-frequency multilayer first- or second-level integrated-circuit/monolithic-microwave integrated-circuit (IC/MMIC) packages. The coax via design modeled in this paper breaks new ground in achieving more than 30-dB ultrawide-band crosstalk reduction and providing an enhanced impedance match.
ISSN:0018-9480
1557-9670
DOI:10.1109/22.641808