Covalent binding of Pd catalysts to ligating self-assembled monolayer films for selective electroless metal deposition

The selective electroless metallization of surfaces modified by chemisorbed ligand-bearing organo-silane ultrathin films is described. It is reasoned that covalent metal-ligand bond formation could serve as an effective mechanism for anchoring a Pd(II) electroless catalyst to an appropriate surface. The process is discussed in terms of development of appropriate Pd(II) catalyst solutions and their interaction with the ligand-modified surfaces. Application of new metallization process to the selective electroless Co and Ni deposition onto silicon and silica substrates photopatterned with organosilicone is presented.