Reliability and yield in fabrication of microcantilever structures using bulk silicon micromachining

Arrays of varying length microcanti levers on a single chip are needed in certain applications. Each cantilever length satisfies a different parameter in the spectrum of functions performed by the array, thus fabrication yield and reliability are of paramount importance. This paper examines all microcantilever fabrication stages and their potential effect on the persisting problem of certain fraction of cantilevers sticking to the walls of the wells. A theoretical model for this behaviour is proposed. This model is based on the localized static charges generated from dissociating etching products' traces in deionized water and then separated because of the differences in electrochemical potentials of the cantilever (Silicon dioxide) and substrate material (Silicon).