Optimization of the adhesive joint Iosipescu specimen for pure shear test
This paper reviews some of the difficulties encountered in achieving a uniform stress distribution within the adhesive layer of bonded Iosipescu shear test specimens. The asymptotic singular stress field at the terminus of a skewed bimaterial interface, intersecting the straight free surface of the...
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Veröffentlicht in: | International journal of fracture 1996-01, Vol.76 (1), p.1-20 |
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Hauptverfasser: | , , , |
Format: | Artikel |
Sprache: | eng |
Online-Zugang: | Volltext |
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Zusammenfassung: | This paper reviews some of the difficulties encountered in achieving a uniform stress distribution within the adhesive layer of bonded Iosipescu shear test specimens. The asymptotic singular stress field at the terminus of a skewed bimaterial interface, intersecting the straight free surface of the wedge, has been studied macroscopically and microscopically using the finite element method (FEM) and the finite element iterative method (FEIM). Different mechanical properties of the adhesives and adherends, and various skewed interface angles have been considered in this study. A critical skewed interface angle, alpha sub c =126 deg , has been found beyond which the interfacial stress singularity vanishes. This critical angle is independent of the elastic properties of the adhesives and adherends. Based on the results obtained in the present investigation, in conjunction with recently reported research on sharp notches [7,21-23], an optimized adhesive joint Iosipescu specimen geometry is proposed. This specimen should be capable of generating a uniform shear stress state within its adhesive layer under pure shear loading conditions. |
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ISSN: | 0376-9429 |
DOI: | 10.1007/BF00034027 |