Thermomechanical behaviour of pin joints subjected to sheet loads

An important problem regarding pin joints in a thermal environment is addressed. The motivation emerges from structural safety requirements in nuclear and aerospace engineering. A two-dimensional model of a smooth, rigid misfit pin in a large isotropic sheet is considered as an abstraction. The shee...

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Veröffentlicht in:International journal of mechanical sciences 1993, Vol.35 (1), p.1-17
Hauptverfasser: Singh, Ripudaman, Ramamurthy, T.S.
Format: Artikel
Sprache:eng
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Zusammenfassung:An important problem regarding pin joints in a thermal environment is addressed. The motivation emerges from structural safety requirements in nuclear and aerospace engineering. A two-dimensional model of a smooth, rigid misfit pin in a large isotropic sheet is considered as an abstraction. The sheet is subjected to a biaxial stress system and far-field unidirectional heat flow. The thermoelastic analysis is complex due to non-linear load-dependent contact and separation conditions at the pin-hole interface and the absence of existence and uniqueness theorems for the class of frictionless thermoelastic contact problems. Identification of relevant parameters and appropriate synthesis of thermal and mechanical variables enables the thermomechanical generalization of pin-joint behaviour. This paper then proceeds to explore the possibility of multiple solutions in such problems, especially interface contact configuration.
ISSN:0020-7403
1879-2162
DOI:10.1016/0020-7403(93)90060-8