Preparation of substrates for microarray protein chips with different ending functional groups
Protein microarray chips are composed of three components, these are pre-treatment substrates, surface chemical modification, and immobilizing protein on substrate surfaces. In this study, self-assembly monolayers are used for surface chemical modification. Using this method, silanization on a glass...
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Veröffentlicht in: | Journal of immunological methods 2022-03, Vol.502, p.113218-113218, Article 113218 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | Protein microarray chips are composed of three components, these are pre-treatment substrates, surface chemical modification, and immobilizing protein on substrate surfaces. In this study, self-assembly monolayers are used for surface chemical modification. Using this method, silanization on a glass and silicon chip is achieved, forming the terminal group substrates. Modification of the substrate surface to provide COOH and NH2 terminal functional groups provides a mechanism to proteins to immobilize on the substrate surface. To observe immobilized proteins on the substrate surface, they are first labeled with Cy5 fluorescent dye before analysis using a GenePix 4000B Microarray Scanner. The scanner induces fluorescence in the labelling dye and the resulting light is analyzed to provide information concerning both the quantity of immobilized protein, and the orientation of attachment. The antigen of the HSV-1 virus, a common human virus, was used in this study, performing an antigen-antibody analysis to determine the efficacy of the method under test for clinical diagnosis.
Schematic of 5 Cy5-streptavidin concentration dot (a) blocking, (b) washed with PBS solution 1× for 6 min. [Display omitted]
•Silanization on a glass and silicon chip formed the terminal group substrates.•The antigen of the HSV-1 virus performed an antigen-antibody analysis.•The epoxide ending functional group glass chip reached preliminary expected effect.•An antibody with gD protein generate a bonding to fix on the glass chip surface. |
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ISSN: | 0022-1759 1872-7905 |
DOI: | 10.1016/j.jim.2022.113218 |