Principles of particle selection for dispersion-strengthened copper
A new fundamental approach to the design of high strength, high thermal conductivity dispersion-strengthened copper alloys for applications in actively cooled structures is developed. This concept is based on a consideration of the basic principles of thermodynamics, kinetics and mechanical properti...
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Veröffentlicht in: | Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 1993-11, Vol.171 (1), p.115-125 |
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Format: | Artikel |
Sprache: | eng |
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Zusammenfassung: | A new fundamental approach to the design of high strength, high thermal conductivity dispersion-strengthened copper alloys for applications in actively cooled structures is developed. This concept is based on a consideration of the basic principles of thermodynamics, kinetics and mechanical properties. The design requirements for these materials include a uniform distribution of fine particles for creep and fatigue resistance, a high thermal conductivity, thermodynamic and chemical stability at temperatures up to 1300 K, a small difference in the coefficients of thermal expansion between the particle and matrix, and low particle coarsening rates at the processing and service temperatures. The theory for creep of dispersion-strengthened metals developed by Rösler and Arzt is used to predict the optimum particle size for a given service temperature and to illustrate the need for a high interfacial energy. Resistance to coarsening leads to a requirement for low diffusivity and solubility of particle constituent elements in the matrix. Based on the needs for a low difference in the coefficients of thermal expansion to minimize thermal-mechanical fatigue damage and low diffusivity and solubility of the constituent elements, several candidate ceramic phases are compared using a weighted property index scheme. The results of this quantitative comparison suggest that CeO
2, MgO, CaO and possibly Y
2O
3 may be good candidates for the dispersed phase in a copper matrix. |
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ISSN: | 0921-5093 1873-4936 |
DOI: | 10.1016/0921-5093(93)90398-X |