Effect of ambient air on fatigue crack propagation in copper compact tension bicrystals

The effect of environment on fatigue crack propagation in copper compact tension (CT) bicrystals was examined. The role of the initial grain boundary (GB) structure is analyzed for bicrystals having Σ9 and Σ41 grain boundaries. It is shown that the GB is not necessarily a preferential site for crack...

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Veröffentlicht in:	Materials science & engineering. A, Structural materials : properties, microstructure and processing Structural materials : properties, microstructure and processing, 1996-10, Vol.216 (1), p.30-40
Hauptverfasser:	Vinogradov, A., Mimaki, T., Hashimoto, S.
Format:	Artikel
Sprache:	eng
Schlagworte:	Applied sciences Compact tension bicrystals Copper Cross-disciplinary physics: materials science rheology Exact sciences and technology Fatigue crack propagation Fatigue, corrosion fatigue, embrittlement, cracking, fracture and failure Fatigue, embrittlement, and fracture Materials science Metals. Metallurgy Physics Treatment of materials and its effects on microstructure and properties
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Zusammenfassung:	The effect of environment on fatigue crack propagation in copper compact tension (CT) bicrystals was examined. The role of the initial grain boundary (GB) structure is analyzed for bicrystals having Σ9 and Σ41 grain boundaries. It is shown that the GB is not necessarily a preferential site for crack propagation in vacuum. A crack introduced intergranularly in air may change its mode of growth to transgranular in vacuum. The relative importance of GB cracking compared with persistent slip band (PSB) cracking in vacuum is examined. The dominant mechanism of fracture is determined by two factors: the GB structure and the geometry of slip with respect to the GB orientation.
ISSN:	0921-5093 1873-4936
DOI:	10.1016/0921-5093(96)10383-X