Adhesive interface element for bonding of laminated plates

An isoparametric adhesive interface element is used in the stress analysis of adhesive-bonded structures. The model assumes that transverse shear and peel stresses prevail in the adhesive layer. The analyses articulate separate responses of the plate, overlays and the adhesive. The stress distribution in the adhesive layer, obtained for lap joints, is found to be in agreement with those obtained by previous authors. To extend the use of bonded joints, the deflection of patched plates under transverse loading and the stress concentration in a plate having a center hole reinforced by a ring patch are also analyzed. The present element, together with the eight-node isoparametric plate element based on first order shear deformation theory used to model the plate and overlay patch, is found to have an advantage in solving problems of adhesive-bonded structures.