Laser processing of amorphous silicon for large-area polysilicon imagers

Pulsed excimer-laser processing of amorphous silicon on non-crystalline substrates allows for the fabrication of high-quality polysilicon materials and thin-film transistors (TFTs). Under optimized processing conditions, these polysilicon TFTs have high mobilities, sharp turn-on, low off-state leaka...

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Veröffentlicht in:Thin solid films 2001-02, Vol.383 (1-2), p.137-142
Hauptverfasser: Boyce, J.B., Fulks, R.T., Ho, J., Lau, R., Lu, J.P., Mei, P., Street, R.A., Van Schuylenbergh, K.F., Wang, Y.
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Sprache:eng
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Zusammenfassung:Pulsed excimer-laser processing of amorphous silicon on non-crystalline substrates allows for the fabrication of high-quality polysilicon materials and thin-film transistors (TFTs). Under optimized processing conditions, these polysilicon TFTs have high mobilities, sharp turn-on, low off-state leakage currents and good spatial uniformity. These improved parameters, particularly the low off-state leakage currents and good uniformity, enable, not only displays, but also the more demanding flat-panel imaging arrays to be fabricated in polysilicon, and results on an imager are presented.
ISSN:0040-6090
1879-2731
DOI:10.1016/S0040-6090(00)01585-6