On-axis shielded sputtering of Y-Ba-Cu-O

In the standard process for sputtering of YBCO, the substrate is located off the axis of the target. Using a particle shield and dc bias, we have deposited high-quality YBCO films on axis at significantly reduced pressures. Typically these films have electrical properties comparable to off-axis film...

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Veröffentlicht in:Materials letters 1992-03, Vol.13 (2), p.89-92
Hauptverfasser: Yin, E, Rubin, M, Hopper, C.B
Format: Artikel
Sprache:eng
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Zusammenfassung:In the standard process for sputtering of YBCO, the substrate is located off the axis of the target. Using a particle shield and dc bias, we have deposited high-quality YBCO films on axis at significantly reduced pressures. Typically these films have electrical properties comparable to off-axis films reported in the literature, and deposition rates are 2 to 3 times faster. Even more important is the return to a geometry that is inherently scalable to large-area deposition.
ISSN:0167-577X
1873-4979
DOI:10.1016/0167-577X(92)90114-Y