Enhancement of copper adhesion on alumina induced by ion-beam mixing

There is a scientific and technological interest in understanding and controlling the bonding process for joining metal to ceramics. Ion-beam mixing with 1.5 MeV-energy xenon-ion irradiation induces a significant enhancement of adhesion between thin copper films and polycrystalline alumina substrate...

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Veröffentlicht in:	Journal of materials science letters 1990-01, Vol.9 (1), p.97-99
Hauptverfasser:	Fuchs, G, Abonneau, E, Treilleux, M, Perez, A
Format:	Artikel
Sprache:	eng
Online-Zugang:	Volltext
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