Integrated Assembly and Photopreservation of Topographical Micropatterns

Micromanipulation techniques that are capable of assembling nano/micromaterials into usable structures such as topographical micropatterns (TMPs) have proliferated rapidly in recent years, holding great promise in building artificial electronic and photonic microstructures. Here, a method is reporte...

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Veröffentlicht in:Small (Weinheim an der Bergstrasse, Germany) Germany), 2021-09, Vol.17 (37), p.e2103702-n/a
Hauptverfasser: Zhang, Shuailong, Li, Weizhen, Elsayed, Mohamed, Peng, Jiaxi, Chen, Yujie, Zhang, Yanfeng, Zhang, Yibo, Shayegannia, Moein, Dou, Wenkun, Wang, Tiancong, Sun, Yu, Kherani, Nazir P., Neale, Steven L., Wheeler, Aaron R.
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Sprache:eng
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Zusammenfassung:Micromanipulation techniques that are capable of assembling nano/micromaterials into usable structures such as topographical micropatterns (TMPs) have proliferated rapidly in recent years, holding great promise in building artificial electronic and photonic microstructures. Here, a method is reported for forming TMPs based on optoelectronic tweezers in either “bottom‐up” or “top‐down” modes, combined with in situ photopolymerization to form permanent structures. This work demonstrates that the assembled/cured TMPs can be harvested and transferred to alternate substrates, and illustrates that how permanent conductive traces and capacitive circuits can be formed, paving the way toward applications in microelectronics. The integrated, optical assembly/preservation method described here is accessible, versatile, and applicable for a wide range of materials and structures, suggesting utility for myriad microassembly and microfabrication applications in the future. A new method is reported for forming topographical micropatterns (TMPs) based on optoelectronic tweezers combined with in situ photopolymerization to form permanent structures. This work demonstrates that the assembled/cured TMPs can be harvested and transferred to alternate substrates, and illustrates how conductive traces and capacitive circuits can be formed, paving the way toward applications in microelectronics.
ISSN:1613-6810
1613-6829
DOI:10.1002/smll.202103702